Seminar on 


"Joining of Copper and Copper Alloys – Latest Developments"







25th November, 2011



The above seminar was organized by Indian Copper Development Centre (ICDC) in Bangalore on 25th November, 2011.


Joining technology of copper and copper alloys plays an important role in fabricating various copper based products.  In order to achieve optimum production efficiency and quality, the joining process namely soldering, brazing and welding, must be carefully controlled.  Moreover several new developments have taken place in joining technology in order to improve the operational efficiency and performance of the joints.


ICDC organized this seminar in order to create awareness on latest developments taken place in the field of soldering, brazing and welding techniques of copper and copper alloys.


Eight papers were presented and about 60 participants attended the programme from all parts of the country.  They represented not only technology suppliers for soldering, brazing & welding but also research institute, electronic industries, solar water heater manufacturers, electrical equipment manufacturers, air conditioning & refrigeration manufacturers, ship builders, oil refinery, copper based product manufacturers, etc.


During the opening session Mr. Kurien Verghese, Director, Hybrid Metals Pvt. Ltd., welcomed the participants.  He mentioned how this type of focused technology oriented seminars can help in creating awareness on technology developments aiming at quality improvement, minimizing rejection and improving cost effectiveness.


Dr. P. Sriram, Vice Chairman, Rapsri Engineering Industries Ltd., delivered the Opening Address. He emphasized on the need for development of better joining technology and its adoption.



Mr. A. Palani, General Secretary, Karnataka Solar Manufacturers’ Association, also addressed the participants as a Special Guest.  He stated that almost 80% of the solar water heater manufacturers are located in Bangalore and this industry is looking for  low cost technology for joining of copper tube and sheet to bring down the cost of solar water heater.


Dr. D. De Sarkar, Chief Executive Officer, Indian Copper Development Centre, proposed the Vote of Thanks.  He  mentioned that adoption of any technology or material has to be need based and with assured performance, and this responsibility lies with both the technology providers and users. 


The two technical sessions were chaired by Dr. D. De Sarkar and Mr. R. Krishnamurthy, Vice President – Operations, Maruthi Impex, Bangalore respectively.

Dignitaries sitting on the dais (L – R) : Mr. Kurien Varghese, Dr. P.Sriram , Mr. A. Palani, Dr. D. De Sarkar.


A view of audience.


Interactive session in progress.                       

Interactive session in progress.



The following papers were presented during the seminar :



·           Cookson Electronics Assembly – Lead Free Alloy : An Overview

by P. Richard, Cookson India Pvt. Ltd., Chennai


·           New Trend in Copper Phosphorus – “CuP” – Brazing Alloys

by Sumant Mathure, Mathure Metal Works Pvt. Ltd., Thane


·           Present & Future Trends in Soldering & Brazing

by Shrikant P. Kelkar, Kranti Metallurgy Pvt. Ltd., Pune


·           Welding and Brazing of Copper & Its Alloys

by A. Nagendra Reddy, Ador Fontech Ltd., Bengaluru


·        Welding of Copper and Copper Alloys – The Practices and Experiences of WRI

by Dr. A. Raja, N. Rajasekaran, Lucky Gaur & A. Santhakumari, Welding Research   Institute, BHEL, Tiruchirappalli


·        Assuring the in-Service Performance of Welded Copper Products

by N. Ramesh Rao, Syn-Ergomachines Pvt. Ltd., Bengaluru


·        Joining of Copper with Steel – A  Joint Study

by  S. Kulasekaran, J. V. Koteswara Rao, D. Suresh Babu & B. Jeya Ganesh,

Esab India Ltd., Chennai


·        Fronius TIG Power Sources for Copper Welding

by B. S. Saluja & N. Aravind, EWAC Alloys Ltd., Mumbai


Before the conclusion of both the sessions very lively discussion took place during which the authors of the papers answered the queries raised by the participants.